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- Article name
- THE METHODS OF MULTICHIP MICROMODULES ENGINEERING CALCULATIONS AND DESIGN
- Authors
- Pogalov A. I., , dtm@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
Blinov G. A., , mg@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
Nebusov V. M., , , National Research University of Electronic Technology, Moscow, Russia
Chugunov E. U., , Chugunov-EU@inbox.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
- Keywords
- multichip micromodules / finite-element models / thermal strength / design of free-dimensional modules
- Year
- 2011 Issue 3 Pages 42 - 46
- Code EDN
- Code DOI
- Abstract
- The method of multichip micromodules (MCM) engineering calculations and design is considered. The finite-element models are produced, the results of modelling are presented, the recommendations of MCM design are developed.
- Text
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