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- Article name
- THERMAL BURDENING AND MATERIALS STRENGTH OF THREE-DIMENSIONAL MULTICHIP MICROMODULE
- Authors
- Pogalov A. I., , dtm@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
Blinov G. A., , mg@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
CHUGUNOV E. Yu., , , National Research University of Electronic Technology, Moscow, Russia
Nebusov V. M., , , National Research University of Electronic Technology, Moscow, Russia
- Keywords
- three-dimensional multichip module / structural strength of micromodules / heat sink in the MCM
- Year
- 2012 Issue 2 Pages 20 - 25
- Code EDN
- Code DOI
- Abstract
- The thermal burdening of structural of a three-dimensional multichip module (MCM) with a copper bar heat sink and without it has been researched. The law influence of the copper plate thickness to the chips overheat temperature in a MCM has been established. The recommendations of a three-dimensional micromodules with heat sink design have been developed.
- Text
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