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- Article name
- TECHNIQUE OF DIAGNOSTIC MODELING OF THERMAL FIELD OF PRINTED-CIRCUIT ASSEMBLY BASED ON POINT MEASUREMENTS OF TEMPERATURES OF ITS COMPONENT ELEMENTS
- Authors
- Tikhonov A. N., , Atikhonov@hse.ru, Moscow Institute of Electronics and Mathematics of National Research University "Higher School of Economics", Moscow, Russia
Uvaysov S. U., , s.uvaysov@hse.ru, Moscow Institute of Electronics and Mathematics of National Research University "Higher School of Economics", Moscow, Russia
Kokin N. N., , nikolay.kokin@mail.ru, National Research University High School of Economics, Moscow, Russia
Semenenko A. N., , asemenenko@hse.ru, National Research University High School of Economics, Moscow, Russia
- Keywords
- thermal field / printed-circuit assembly / electronic means / radioelectronic equipment / thermal sensor / measurement of temperature / modeling of thermal processes / thermocouple / pyrometer / thermal imager
- Year
- 2015 Issue 4 Pages 69 - 75
- Code EDN
- Code DOI
- Abstract
- The paper proposes a method of diagnostic modeling of the thermal field of the printing unit based on point measurements of temperature of its component elements. The technique can detect hidden faults and failures due to the accounting relationship between the measured and simulated temperature fields. Assessment of the distribution of temperature fields PCA is based on an array of simulated temperature at the control points of the printing unit and carried out physical measurements. On the basis of the data we conclude that there is a failure in the PCA.
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